Reduce heat sink and hardware assembly
- Categories:News
- Author:
- Origin:
- Time of issue:2021-06-03
- Views:2
(Summary description)Reduce the assembly of radiator and hardware (including heat conduction interface material), reduce the volume of module, and reduce the cost of hardware and assembly;
Reduce heat sink and hardware assembly
(Summary description)Reduce the assembly of radiator and hardware (including heat conduction interface material), reduce the volume of module, and reduce the cost of hardware and assembly;
- Categories:News
- Author:
- Origin:
- Time of issue:2021-06-03
- Views:2
Reduce the assembly of radiator and hardware (including heat conduction interface material), reduce the volume of module, and reduce the cost of hardware and assembly;
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